TWI765664B
Provided are a cutting line formation device and formation method with which it is possible to form a highly precise cutting line without employing a complicated large-scale configuration. The present invention provides a cutting line formation device for continuously forming a cutting line extendin...
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Format: | Patent |
Sprache: | chi |
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Zusammenfassung: | Provided are a cutting line formation device and formation method with which it is possible to form a highly precise cutting line without employing a complicated large-scale configuration. The present invention provides a cutting line formation device for continuously forming a cutting line extending in the width direction in a long, web-form optical film laminate that includes a long, web-form carrier film and a long, web-form optical film laminated on the carrier film with an adhesive layer interposed therebetween. The cutting line formation device comprises a cutting line formation unit, a transport direction changing unit, and a cutting line detection unit. The cutting line formation unit forms the cutting line in the optical film laminate, which is transported in a horizontal direction from the surface on the side opposite from the carrier film. The transport direction changing unit is positioned on the transport-direction downstream side from the cutting line formation unit, and changes the transport di |
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