TWI765399B

The present invention addresses the problem of providing a heat-curable composition that demonstrates superior storage stability at high temperature and superior heat-curability of a curing film surface at high temperature and high humidity, as well as a heat-curable inkjet ink that uses said heat-c...

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Bibliographische Detailangaben
Hauptverfasser:	TANI, KUNIO, SUGITA, SHUICHI
Format:	Patent
Sprache:	chi
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention addresses the problem of providing a heat-curable composition that demonstrates superior storage stability at high temperature and superior heat-curability of a curing film surface at high temperature and high humidity, as well as a heat-curable inkjet ink that uses said heat-curable composition.　This heat-curable composition includes a blocked isocyanate (A), and is characterized by also including: a compound (B) that has a functional group capable of hydrogen bonding with the blocked isocyanate (A); and a (meth)acryloyl group-including monomer (C) that does not have a functional group capable of reacting with blocked isocyanates, wherein per 100 parts by mass of the (meth)acryloyl group-including monomer (C), the heat-curable composition includes 0.1-20 parts by mass of the compound (B) and 0.1-20 parts by mass of the blocked isocyanate (A).