TWI764561B

TWI764561B

Provided is a phenolic resin foam laminate board in which a flexible surface material is arranged on at least upper and lower surfaces of a phenolic resin foam. The phenolic resin foam contains HCFO-1224yd(Z), has a density of not less than 20kg/m3 and not more than 55kg/m3, a closed cell ratio of 8...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MIYATA, NARUMI, HIRAMATSU, NOBUKI, MIHORI, HISASHI
Format: Patent
Sprache:chi
Schlagworte:
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
PERFORMING OPERATIONS
TRANSPORTING
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Beschreibung
Zusammenfassung:Provided is a phenolic resin foam laminate board in which a flexible surface material is arranged on at least upper and lower surfaces of a phenolic resin foam. The phenolic resin foam contains HCFO-1224yd(Z), has a density of not less than 20kg/m3 and not more than 55kg/m3, a closed cell ratio of 80% or more, an average cell diameter of not less than 60 µm and not more than 200 µm, a percentage of an area seeping out from the surface material is 30% or less, and content of HCFO-1224yd(Z) per space volume of 22.4 × 10-3m3 in the phenolic resin foam is not less than 0.06 mol and not more than 0.35 mol.