A method for activating a surface of a non-conductive or carbon-fibres containing substrate for metallization

Method for activating a surface of a non-conductive or carbon-fibres containing substrate for metallization, the method including:(a) providing said substrate,(b) providing an aqueous, palladium-free activation composition comprising(i) a first species of dissolved transition metal ions and addition...

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Bibliographische Detailangaben
Hauptverfasser:	GAIDA, JOSEF, IVANOVA, LENA, STAMP, LUTZ, THOMAS, THOMAS
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	Method for activating a surface of a non-conductive or carbon-fibres containing substrate for metallization, the method including:(a) providing said substrate,(b) providing an aqueous, palladium-free activation composition comprising(i) a first species of dissolved transition metal ions and additionally metal particles thereof,(ii) at least one complexing agent,(iii) permanently or temporarily at least one reducing agent,(iv) optionally one or more second species of dissolved metal ions different from the first species,(c) contacting the substrate with said activation composition such that a transition metal or a transition metal alloy is deposited on the surface of said substrate and an activated surface for metallization is obtained.