TWI763902B

A semiconductor device which comprises: a substrate; a semiconductor element which is arranged on the substrate; a wire which electrically connects the substrate and the semiconductor element with each other; a first sealing layer which seals the space below the tip of the wire; and a second sealing...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SATOH, EIICHI, TAKEMORI, DAICHI, SATO, MIZUKI, TOGAWA, MITSUO, YAMADA, KAZUHIKO, SEKI, KOHEI
Format:	Patent
Sprache:	chi
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	A semiconductor device which comprises: a substrate; a semiconductor element which is arranged on the substrate; a wire which electrically connects the substrate and the semiconductor element with each other; a first sealing layer which seals the space below the tip of the wire; and a second sealing layer which is provided on top of the first sealing layer, with the bonding wire being interposed therebetween. This semiconductor device is configured such that: the first sealing layer is composed of a cured film of a liquid sealing material; and the second sealing layer is composed of a dried coating film of an insulating resin coating material.