TWI763811B

A liquid curable silicone adhesive composition is provided. The composition is generally storage stable as a one-part composition at room temperature, can primarily cure at room temperature in the presence of moisture, and can secondarily cure at high temperatures, and can form a strong adhesive lay...

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Bibliographische Detailangaben
Hauptverfasser:	KODAMA, HARUMI, FUJISAWA, TOYOHIKO, USHIO, YOSHITO
Format:	Patent
Sprache:	chi
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	A liquid curable silicone adhesive composition is provided. The composition is generally storage stable as a one-part composition at room temperature, can primarily cure at room temperature in the presence of moisture, and can secondarily cure at high temperatures, and can form a strong adhesive layer on a substrate or member. The liquid curable silicone adhesive composition comprises: a curable reactive organopolysiloxane which has a radical reactive group and a condensation reactive group in the same molecule or throughout the mixture; a condensation reaction catalyst; an organic peroxide; an adhesion imparting agent; and a crosslinkable silane. Herein, regarding the storage modulus (G′1) of a cured product obtained by primarily curing the composition in the presence of moisture approximately at room temperature, along with the storage elastic modulus (G′2) of a cured pro duct obtained by curing the composition, the increase rate (Δ) of the storage elastic modulus is at least 50%.