CURVED SURFACE BONDING DEVICE

A curved surface bonding device including a bonding head, a carrier, a first driving unit and a fluid source is provided. The boding head driven by the first driving unit includes a body and an elastic bonding element which are jointly form a chamber. The elastic bonding element has a first bonding portion with lower Young's modulus and a second bonding portion with higher Young's modulus. The fluid source connected to the chamber for generating a first and a second fluid pressure to the chamber in stages. When the pressure of the fluid source is raised to the first fluid pressure, the first bonding portion deforms elastically to press part of a soft film to meet a curved surface bonded object. When the pressure of the fluid source is raised to the second fluid pressure, the second bonding portion presses the soft film until the soft film totally meeting the curved surface bonded object. Therefore, a mold changing is not necessary for meeting different curved surface bonded object, and bubbles could be elimin