Bond pad structure and manufacturing method thereof

A bond pad structure and a manufacturing method thereof are disclosed. The bond pad structure includes a first metal layer, and at least two second metal layers laminated successively on the first metal layer. Dielectric layers are provided between the first metal layer and the second metal layers, and between every two adjacent second metal layers. The first metal layer and the the second metal layer adjacent to the first metal layer are electrically connected to each other in a region outside the bonding pad structure. Every two adjacent second metal layers are electrically connected to each other. A manufacturing method of the bond pad structure is further disclosed. In this way, it may avoid pits generated by the bonding of copper wires having large sizes.