TWI758461B

The heat curable resin composition according to the present invention is provided as a heat curable resin composition showing both high low-temperature curability and high storage stability such that the heat curable resin composition allows low-temperature curing at 120ºC or less and shows good sto...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	FURUTA, TOMOTSUGU, KIKUCHI, AYAKO, MOROKOSHI, SHINTA
Format:	Patent
Sprache:	chi
Schlagworte:	ADHESIVES CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS COMPUTING CORRECTING FLUIDS COUNTING DECORATIVE ARTS DYES ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS MOSAICS NATURAL RESINS OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PAPERHANGING PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS PHYSICS POLISHES PRINTED CIRCUITS PRODUCING DECORATIVE EFFECTS TARSIA WORK THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	The heat curable resin composition according to the present invention is provided as a heat curable resin composition showing both high low-temperature curability and high storage stability such that the heat curable resin composition allows low-temperature curing at 120ºC or less and shows good storage stability before low-temperature curing. The heat curable resin composition comprises a polyester amide acid (A), an epoxy compound (B) having a fluorene skeleton, and a thiol compound (E) having a plurality of thiol groups in a molecule, and thus, the heat curable resin composition enables low-temperature curing while maintaining good storage stability until low-temperature curing.