Healing particle and method for thermoforming

A method for thermoforming includes adding a plurality of healing particles into a stack, heating the stack to transform a core of the healing particle into a conductive fluid, stretching the stack that forms a plurality of cracks in a conductive layer of the stack and brakes a shell of the healing...

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Bibliographische Detailangaben
Hauptverfasser:	YU, HUIUN, LIN, POING, HSIAO, CHING-PING, LI, CHIAN, HSU, YAU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS CABLES CALCULATING COMPUTING CONDUCTORS COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRICITY INSULATORS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS PHYSICS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A method for thermoforming includes adding a plurality of healing particles into a stack, heating the stack to transform a core of the healing particle into a conductive fluid, stretching the stack that forms a plurality of cracks in a conductive layer of the stack and brakes a shell of the healing particle, releasing the conductive fluid formed of the core from the healing particle which fills the cracks, and forming a plurality of conductive connections by the conductive fluid in the cracks.