Laminate structure, flexible copper clad laminate film including the same, and method of manufacturing the laminate structure

Disclosed are a laminated structure, a flexible copper foil laminated film including same, and a method for manufacturing said laminated structure. The laminated structure comprises: a non-conductive polymer substrate; a nickel-containing plating layer disposed on at least one surface of the substrate; and a first copper plating layer disposed on the nickel-containing plating layer, wherein X-ray diffraction (XRD) analysis of the first copper plating layer shows a [111] crystal plane, and the peeling rate per a unit area of 1 cm2 between the non-conductive polymer substrate and the nickel-containing plating layer may be 1% or less.