TWI756160B

To provide a technology that enables visual inspection of a paste adhesive that undergoes a shape change after application.SOLUTION: A die bonder is configured to measure the time between an operation of applying paste adhesive to a metal frame and an operation of taking an image of the paste adhesi...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	TAKANO, HARUYUKI, NAKAJIMA, NOBUHISA, MAKI, HIROSHI, KOBASHI, HIDEHARU, NAITO, DAISUKE
Format:	Patent
Sprache:	chi
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	To provide a technology that enables visual inspection of a paste adhesive that undergoes a shape change after application.SOLUTION: A die bonder is configured to measure the time between an operation of applying paste adhesive to a metal frame and an operation of taking an image of the paste adhesive in a registration operation before mass production, wait for the measured time after applying the paste adhesive to the metal frame, and then take an image of the paste adhesive applied to the metal frame to obtain a reference inspection image.SELECTED DRAWING: Figure 5