Carrier substrate and printed circuit board fabricated using the same

A printed circuit board according to one aspect of the present invention, divided into a rigid unit and a flexible unit, comprises: a flexible adhesive layer; a first flexible insulation layer and a second flexible insulation layer respectively stacked on upper and lower surfaces of the flexible adhesive layer; a rigid insulation layer formed on the first flexible insulation layer and the second flexible insulation layer by corresponding to the rigid unit; a first circuit which is embedded in the lower surface of the flexible adhesive layer and of which one surface comes in contact with the second flexible insulation layer and the other surfaces are surrounded by the flexible adhesive layer; a second circuit formed on an upper surface of the flexible insulation layer and a lower surface of the second flexible insulation layer; and a third circuit formed on the rigid insulation layer.