TWI754978B

Provided are a microstructure transfer device and a microstructure transfer method that are capable of fixing multiple replicas onto a sheet object (film). The microstructure transfer device (1) comprises: an unwinder (5) on which a flexible sheet object (4) is wound and which unwinds the sheet obje...

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Bibliographische Detailangaben
Hauptverfasser:	WATASE, NAOKI, KISHIMURA, TOSHIHARU, NAKAYAMA, YUKINORI, NAKAZAWA, YOSHIHITO, IMAI, HIROAKI
Format:	Patent
Sprache:	chi
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	Provided are a microstructure transfer device and a microstructure transfer method that are capable of fixing multiple replicas onto a sheet object (film). The microstructure transfer device (1) comprises: an unwinder (5) on which a flexible sheet object (4) is wound and which unwinds the sheet object (4); a winder (6) to wind the sheet object (4) transported via a plurality of guide rolls (3); a stage (11) which is between the unwinder (5) and the winder (6) and on which a mold (14) with a fine uneven patterned surface coated with a photocurable resin is placed; an imprint roll (2) to at least reciprocate between both ends of the mold (14) while pressing the sheet object (4) downward against the mold (14); and a curing light irradiator (8) to irradiate the sheet object (4) pressed against the mold (14) with ultraviolet light; thereby sequentially fixing a plurality of replicas (20) onto the sheet object (4).