TWI754669B

The present invention provides a silver paste that can form a wiring having a low electrical resistivity. In this invention, a silver paste is provided for forming an electrode of an electronic component. The silver paste comprises: a first silver powder; a second silver powder having a relatively s...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	TACHIBANA, HIROKI
Format:	Patent
Sprache:	chi
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CONDUCTORS CORRECTING FLUIDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	The present invention provides a silver paste that can form a wiring having a low electrical resistivity. In this invention, a silver paste is provided for forming an electrode of an electronic component. The silver paste comprises: a first silver powder; a second silver powder having a relatively small average particle diameter with respect to the first silver powder; a binder resin; and a dispersion medium. The first silver powder satisfies all of the following conditions from (A1) to (A4): (A1) the ignition loss when heated to 600 DEG C is 0.05% or less; (A2) the tap density is 5 g/cm3 or more; (A3) the maximum aspect ratio is 1.4 or less; (A4) the specific surface area based on the BET method is 0.8 m2 /g or less. The ignition loss when the second silver powder (B1) is heated to 600 DEG C is 0.05% or less. The ratio (DL50/DS50), which is defined as the average particle diameter (DL50) of the first silver powder to the average particle diameter (DS50) of the second silver powder, is 5 or more.