Curable composition, cured object, overcoat film and flexible wiring board and a method of manufacturing thereof

Provided is a curable composition highly effective in preventing flexible wiring boards from warping and in inhibiting the flexible wiring boards from suffering wiring breakage. The curable composition is for use in producing a flexible wiring board from a flexible substrate having wiring formed the...

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Bibliographische Detailangaben
Hauptverfasser:	YAMAMOTO, RYUNOSUKE, ISHIBASHI, YOSHITAKA, OOGA, KAZUHIKO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	Provided is a curable composition highly effective in preventing flexible wiring boards from warping and in inhibiting the flexible wiring boards from suffering wiring breakage. The curable composition is for use in producing a flexible wiring board from a flexible substrate having wiring formed thereon, by coating the wiring-including surface portions of the flexible substrate with an overcoat film, the overcoat film being formed by curing the curable composition. The cured object obtained from this curable composition has a tensile modulus of 600-2,000 MPa and a tensile yield strength of 17 MPa or greater.