Support attached printed circuit board and manufacturing method therof

To provide a support adhesion printed circuit board which facilitates handling in the whole package process, while improving package yield.SOLUTION: In a support adhesion printed circuit board 1000, the board part 100 includes a first outer layer conductor pattern layer 11, and a first solder resist...

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Bibliographische Detailangaben
Hauptverfasser:	KIM, SANG-HOON, KO, YOUNG-KUK, HAN, YOUN-GYU, OH, YOONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	To provide a support adhesion printed circuit board which facilitates handling in the whole package process, while improving package yield.SOLUTION: In a support adhesion printed circuit board 1000, the board part 100 includes a first outer layer conductor pattern layer 11, and a first solder resist layer 21 formed on the first outer layer conductor pattern layer, and in which a first opening 310 for exposing at least a part of the first outer layer conductor pattern layer 11 is formed. The support 200 is formed on the first solder resist layer, and includes a mask pattern layer 210 in which a second opening 320, communicating with the first opening 310, is formed, and a support isolating layer 220 formed on the mask pattern layer, and in which a third opening 330 communicating with the second opening 320 is formed. Diameters of the first and third openings 310, 330 decrease as they go down.SELECTED DRAWING: Figure 1