Polyamide resin composition and molded article obtained by molding the same

Polyamide resin composition and molded article obtained by molding the same

Provided is a polyamide resin composition characterized by containing a semi-aromatic polyamide (A) having a melting point of 280-320°C, an aliphatic polyamide (B), 5-30 mass% of a metal phosphinate salt (C), 5-60 mass% of a reinforcing material (D), 0.1-8 mass% of a metal carbonate salt (E), and 0....

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MII, JUNICHI, MASAKI, TATSUNORI, KAMIKAWA, HIROO
Format: Patent
Sprache:chi ; eng
Schlagworte:
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
GENERAL PROCESSES OF COMPOUNDING
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
WORKING-UP
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Provided is a polyamide resin composition characterized by containing a semi-aromatic polyamide (A) having a melting point of 280-320°C, an aliphatic polyamide (B), 5-30 mass% of a metal phosphinate salt (C), 5-60 mass% of a reinforcing material (D), 0.1-8 mass% of a metal carbonate salt (E), and 0.01-3 mass% of a fatty acid barium salt (F), wherein the sum content of (A) and (B) is 30-85 mass%, and the mass ratio (A/B) of (A) to (B) is 90/10-40/60.