TWI749123B

A surface treated copper foil having laminated, in order, upon at least one surface of the copper foil, a roughening layer, an antitrust treatment layer, and a silane coupling layer. The surface treated copper foil has a developed area ratio Sdr value for the interface of 8%-140%, said developed are...

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Bibliographische Detailangaben
Hauptverfasser:	SHINOZAKI, KENSAKU, OKUNO, YUKO, UNO, TAKEO
Format:	Patent
Sprache:	chi
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	A surface treated copper foil having laminated, in order, upon at least one surface of the copper foil, a roughening layer, an antitrust treatment layer, and a silane coupling layer. The surface treated copper foil has a developed area ratio Sdr value for the interface of 8%-140%, said developed area ratio being a composite parameter of three-dimensional surface properties measured from the surface of the silane coupling layer.