TWI748252B

The present invention provides a hot-melt coating agent that is excellent in bubble-suppression properties during coating, that is cured in a short period of time after coating, and that is excellent in tack-free properties and bleed-out resistance properties. The present invention provides a hot-me...

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Bibliographische Detailangaben
Hauptverfasser:	YOSHIMURA, KEIJI, NISHIDA, HARUHIKO, NAGATA, YOSHIKI
Format:	Patent
Sprache:	chi
Schlagworte:	ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS DYES FILLING PASTES INKS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	The present invention provides a hot-melt coating agent that is excellent in bubble-suppression properties during coating, that is cured in a short period of time after coating, and that is excellent in tack-free properties and bleed-out resistance properties. The present invention provides a hot-melt coating agent for a component-mounted electronic circuit board that contains a thermoplastic resin (A) and a liquid softener (B); and that has a melt viscosity at 160°C (η1) of 20000 mPa·s or less and a melt viscosity at 180°C (η2) of 10000 mPa·s or less, wherein the ratio of the melt viscosity at 160°C (η1) to the melt viscosity at 180°C (η2) (η1/η2) is 1.0 to 5.0.