Semiconductor device and method for manufacturing the same

A method includes forming a first transistor, which includes forming a first gate dielectric layer over a first channel region in a substrate and forming a first work-function layer over the first gate dielectric layer, wherein forming the first work-function layer includes depositing a work-functio...

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Bibliographische Detailangaben
Hauptverfasser: WANG, YU SHENG, LEE, HSIEN MING, YANG, KAI CYUAN, CHIU, YA WEN, LEE, DA YUAN, FAN, CHIH HSIANG, KUOK, KUN-WA
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:A method includes forming a first transistor, which includes forming a first gate dielectric layer over a first channel region in a substrate and forming a first work-function layer over the first gate dielectric layer, wherein forming the first work-function layer includes depositing a work-function material using first process conditions to form the work-function material having a first proportion of different crystalline orientations and forming a second transistor, which includes forming a second gate dielectric layer over a second channel region in the substrate and forming a second work-function layer over the second gate dielectric layer, wherein forming the second work-function layer includes depositing the work-function material using second process conditions to form the work-function material having a second proportion of different crystalline orientations.