TWI746495B

The present invention addresses the problem of providing a heat-curable resin composition provided with a high refractive index, gas barrier properties, and thermal shock resistance, the heat-curable resin composition having exceptional reliability as an LED sealing material. The heat-curable resin...

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Bibliographische Detailangaben
Hauptverfasser:	ICHIKAWA, KOJI, AYAMA, KOICHI, TAJIMA, AKIO, MATSUO, TAKASHI
Format:	Patent
Sprache:	chi
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention addresses the problem of providing a heat-curable resin composition provided with a high refractive index, gas barrier properties, and thermal shock resistance, the heat-curable resin composition having exceptional reliability as an LED sealing material. The heat-curable resin composition contains the following components (A), (B), and (C). (A) A heat-curable resin that is a reactant of a silsesquioxane having an SiH group and an organopolysiloxane having two alkenyl groups, the heat-curable resin having an SiH group and an alkenyl group; (B) a straight-chain compound having an alkenyl group or an SiH group at both ends, having an allyl group in the main chain, and having a siloxane chain as a primary structure; and (C) a Pt catalyst.