TWI741073B

A lead frame includes a plurality of leads formed from a metal plate having a front side and a back side, a first resin member, and a second resin member. The leads have side faces thereof fixed with the first resin member. Faces serving as internal connectors of the leads are uncovered on the side...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	IIDANI, ICHINORI, HISHIKI, KAORU, YOSHIMOTO, RYOUICHI
Format:	Patent
Sprache:	chi
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A lead frame includes a plurality of leads formed from a metal plate having a front side and a back side, a first resin member, and a second resin member. The leads have side faces thereof fixed with the first resin member. Faces serving as internal connectors of the leads are uncovered on the side of the front-side surface of the first resin member, and faces serving as external connectors of the leads are uncovered on the side of the back-side surface of the first resin member. The second resin member is formed on the front-side surface of the first resin member to be at a level higher than the faces serving as the internal connectors, and has openings for leaving the faces serving as the internal connectors uncovered.