TWI735604B

Provided is a silylation agent solution ensuring reduced flammability without affecting water repellency or hydrophobicity. Moreover, provided are a surface treatment method using the silylation agent solution, and a method for producing a semiconductor device. To this end, the silylation agent solu...

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Bibliographische Detailangaben
Hauptverfasser:	MORI, DAIJIRO, KUMAZAWA, AKIRA
Format:	Patent
Sprache:	chi
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	Provided is a silylation agent solution ensuring reduced flammability without affecting water repellency or hydrophobicity. Moreover, provided are a surface treatment method using the silylation agent solution, and a method for producing a semiconductor device. To this end, the silylation agent solution contains a silylation agent and a solvent which has flammability greater than or equal to 50 DEG C and is at least one selected from the group composed of glycolalkyl ether, a hydrocarbon-based solvent, and straight chain-type or branched chain-type carboxylic acid ester.