TWI732836B
This electromagnetic shielding film is provided with: a shielding layer 111 that is formed of an aluminum film; and a conductive adhesive layer 112. The conductive adhesive layer 112 contains a conductive filler that is composed of spike-like or filament-like nickel particles; and the nickel particl...
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| creator | YANAGI, YOSHIHARU |
| description | This electromagnetic shielding film is provided with: a shielding layer 111 that is formed of an aluminum film; and a conductive adhesive layer 112. The conductive adhesive layer 112 contains a conductive filler that is composed of spike-like or filament-like nickel particles; and the nickel particles have a median diameter (D50) of from 5 μm to 30 μm (inclusive), a mode diameter of 3 μm to 50 μm (inclusive), and a cumulative distribution at the mode diameter of 35% or more. |
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The conductive adhesive layer 112 contains a conductive filler that is composed of spike-like or filament-like nickel particles; and the nickel particles have a median diameter (D50) of from 5 μm to 30 μm (inclusive), a mode diameter of 3 μm to 50 μm (inclusive), and a cumulative distribution at the mode diameter of 35% or more.</description><language>chi</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; DYES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; PRINTED CIRCUITS ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210711&DB=EPODOC&CC=TW&NR=I732836B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210711&DB=EPODOC&CC=TW&NR=I732836B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YANAGI, YOSHIHARU</creatorcontrib><title>TWI732836B</title><description>This electromagnetic shielding film is provided with: a shielding layer 111 that is formed of an aluminum film; and a conductive adhesive layer 112. The conductive adhesive layer 112 contains a conductive filler that is composed of spike-like or filament-like nickel particles; and the nickel particles have a median diameter (D50) of from 5 μm to 30 μm (inclusive), a mode diameter of 3 μm to 50 μm (inclusive), and a cumulative distribution at the mode diameter of 35% or more.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAKCfc0NzayMDZz4mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEAC6wbiA</recordid><startdate>20210711</startdate><enddate>20210711</enddate><creator>YANAGI, YOSHIHARU</creator><scope>EVB</scope></search><sort><creationdate>20210711</creationdate><title>TWI732836B</title><author>YANAGI, YOSHIHARU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI732836BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi</language><creationdate>2021</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>YANAGI, YOSHIHARU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YANAGI, YOSHIHARU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TWI732836B</title><date>2021-07-11</date><risdate>2021</risdate><abstract>This electromagnetic shielding film is provided with: a shielding layer 111 that is formed of an aluminum film; and a conductive adhesive layer 112. The conductive adhesive layer 112 contains a conductive filler that is composed of spike-like or filament-like nickel particles; and the nickel particles have a median diameter (D50) of from 5 μm to 30 μm (inclusive), a mode diameter of 3 μm to 50 μm (inclusive), and a cumulative distribution at the mode diameter of 35% or more.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS USE OF MATERIALS AS ADHESIVES |
| title | TWI732836B |
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