TWI732836B

This electromagnetic shielding film is provided with: a shielding layer 111 that is formed of an aluminum film; and a conductive adhesive layer 112. The conductive adhesive layer 112 contains a conductive filler that is composed of spike-like or filament-like nickel particles; and the nickel particl...

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Bibliographische Detailangaben
1. Verfasser:	YANAGI, YOSHIHARU
Format:	Patent
Sprache:	chi
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	This electromagnetic shielding film is provided with: a shielding layer 111 that is formed of an aluminum film; and a conductive adhesive layer 112. The conductive adhesive layer 112 contains a conductive filler that is composed of spike-like or filament-like nickel particles; and the nickel particles have a median diameter (D50) of from 5 μm to 30 μm (inclusive), a mode diameter of 3 μm to 50 μm (inclusive), and a cumulative distribution at the mode diameter of 35% or more.