Photosensitive adhesive composition and semiconductor device

This photosensitive adhesive composition is characterized by containing (A) an alkali-soluble resin, (B) a photoacid generator, (C) an epoxy compound, and (D) a phenol compound having a melting point of 50-150 °C. By using a cured product of the photosensitive adhesive composition as an adhesive lay...

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Bibliographische Detailangaben
Hauptverfasser:	SUGIYAMA, HIROMICHI, HASHIMOTO, KAZUMI, HORII, MAKOTO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	This photosensitive adhesive composition is characterized by containing (A) an alkali-soluble resin, (B) a photoacid generator, (C) an epoxy compound, and (D) a phenol compound having a melting point of 50-150 °C. By using a cured product of the photosensitive adhesive composition as an adhesive layer that adheres semiconductor elements to one another, it is possible to prevent bubbles (voids) from forming in an interface between the adhesive layer and a semiconductor element, and, even when bubbles form in the interface, to remove said bubbles. As a result, it is possible to enhance the adhesiveness (close adhesion) of semiconductor elements to one another.