Mems device package and method for manufacturing the same

A Micro Electro-Mechanical System (MEMS) device package includes a first circuit layer, a partition wall, a MEMS component, a second circuit layer and a polymeric dielectric layer. The partition wall is disposed over the first circuit layer. The MEMS component is disposed over the partition wall and...

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Bibliographische Detailangaben
Hauptverfasser:	KUNG, CHENG-YUAN, HUANG, CHE-HAU, CHEN, CHIEN-HUA, KUO, CHINNG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TRANSPORTING
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Beschreibung
Zusammenfassung:	A Micro Electro-Mechanical System (MEMS) device package includes a first circuit layer, a partition wall, a MEMS component, a second circuit layer and a polymeric dielectric layer. The partition wall is disposed over the first circuit layer. The MEMS component is disposed over the partition wall and electrically connected to the first circuit layer. The first circuit layer, the partition wall and the MEMS component enclose a space. The second circuit layer is disposed over and electrically connected to the first circuit layer. The polymeric dielectric layer is disposed between the first circuit layer and the second circuit layer.