TWI725936B

The purpose of the invention of the present application is to provide an adhesive sheet with which layer peeling does not readily occur, even if the adhesive sheet is subjected to heat treatment (in particular heat and pressurization treatment). This adhesive sheet is provided with an uneven layer,...

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Bibliographische Detailangaben
Hauptverfasser:	IMOTO, TAKASHI, ARIMOTO, MASAHARU
Format:	Patent
Sprache:	chi
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS SEMICONDUCTOR DEVICES TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The purpose of the invention of the present application is to provide an adhesive sheet with which layer peeling does not readily occur, even if the adhesive sheet is subjected to heat treatment (in particular heat and pressurization treatment). This adhesive sheet is provided with an uneven layer, a base material, and an adhesive layer. The adhesive sheet is characterized in that: the uneven layer is provided to one surface of the base material; the adhesive layer is provided to another surface of the base material; and the arithmetic average roughness (Ra) of the surface of the uneven layer is at least 0.1 µm. It is preferable that the glass transition temperature of the uneven layer be at least 20˚C.