WAFER ALIGNMENT MACHINE

The present invention is a wafer alignment machine comprising a tray and an alignment device. The tray comprises a plurality of grooves located on a first surface thereof for containing a wafer respectively. The alignment device comprises a clamping unit and a first driving device, wherein the first...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YU, NAI-WEI, LIN, JINGNG, YI, CHING-LIANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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