WAFER ALIGNMENT MACHINE

The present invention is a wafer alignment machine comprising a tray and an alignment device. The tray comprises a plurality of grooves located on a first surface thereof for containing a wafer respectively. The alignment device comprises a clamping unit and a first driving device, wherein the first driving device is connected with the clamping unit and used to drive the clamping unit. When a second driving device drives the alignment device to close to the first surface of the tray, the first driving device drives the clamping unit to clamp or push the wafer to align the wafer with the groove. In this way, the wafer feeding and alignment steps can be performed in a fully automatic manner to improve the efficiency of the process and reduce the chance of wafer contamination.