Heating apparatus for substrate and heating method for substrate

To shorten beat time required for temperature reduction of the heating portion. A substrate heating apparatus comprises a pressure reduction portion of performing pressure reduction of atmosphere within the accommodation space of the substrate coated with solution; a heating portion configured at on...

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Bibliographische Detailangaben
Hauptverfasser:	YAMAYA, KENICHI, MASU, YOSHIAKI, KATO, SHIGERU, SAHODA, TSUTOMU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS,IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KINDOF FURNACE ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FURNACES HEATING KILNS LIGHTING MECHANICAL ENGINEERING OVENS RETORTS SEMICONDUCTOR DEVICES WEAPONS
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Beschreibung
Zusammenfassung:	To shorten beat time required for temperature reduction of the heating portion. A substrate heating apparatus comprises a pressure reduction portion of performing pressure reduction of atmosphere within the accommodation space of the substrate coated with solution; a heating portion configured at one side of the substrate and capable of heating the substrate; an infrared ray heater configured at the other side of the substrate and capable of heating the substrate using the infrared ray; and a reflection surface configured between the heating portion and the infrared ray heater and reflecting the infrared ray toward the heating portion.