TWI721955B

[Problem] To provide a method for effectively removing minute impurities of 1 µm or less in size that are present on a surface of an aluminum nitride single-crystal substrate without etching the surface. [Solution] A surface of an aluminum nitride single-crystal substrate is scrubbed using a polymer...

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creator ARIYUKI, MASAO
description [Problem] To provide a method for effectively removing minute impurities of 1 µm or less in size that are present on a surface of an aluminum nitride single-crystal substrate without etching the surface. [Solution] A surface of an aluminum nitride single-crystal substrate is scrubbed using a polymer compound material having lower hardness than an aluminum nitride single crystal, and an alkali aqueous solution having 0.01-1 mass% concentration of an alkali selected from the group consisting of potassium hydroxide and sodium hydroxide, said alkali aqueous solution being absorbed in the polymer compound material.
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[Solution] A surface of an aluminum nitride single-crystal substrate is scrubbed using a polymer compound material having lower hardness than an aluminum nitride single crystal, and an alkali aqueous solution having 0.01-1 mass% concentration of an alkali selected from the group consisting of potassium hydroxide and sodium hydroxide, said alkali aqueous solution being absorbed in the polymer compound material.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
CLEANING
CLEANING IN GENERAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
SEMICONDUCTOR DEVICES
TRANSPORTING
title TWI721955B
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