TWI719896B
The present invention is to provide a technique capable of improving the rigidity of a die. A die bonding device comprises: a collet sucking a die on a dicing tape; and a peeling unit having a movable table stage which is in contact with a portion of the dicing tape located below the die and a fixed...
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| Format: | Patent |
| Sprache: | chi |
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| Zusammenfassung: | The present invention is to provide a technique capable of improving the rigidity of a die. A die bonding device comprises: a collet sucking a die on a dicing tape; and a peeling unit having a movable table stage which is in contact with a portion of the dicing tape located below the die and a fixed stage sucking a portion of the dicing tape located on the outer periphery than the die, and peeling the die from the dicing tape, wherein the movable stage has a concave unit for bending the die to be concave upward. A lower surface of the collet has a curved surface fitted with an upper surface of the curved die. |
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