PHOTOSENSITIVE RESIN COMPOSITION, PHOTO RESIST, DISPLAY DEVICE AND METHOD OF LOW TEMPERATURE CURING PHOTOSENSITIVE RESIN COMPOSITION

The present specification provides: a photosensitive resin composition comprising a binder bearing an epoxy group, and an additive bearing a thiol group and a siloxane; a photosensitive material; a display device; and a method for low-temperature curing of a photosensitive resin composition.

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Bibliographische Detailangaben
Hauptverfasser:	CHOI, A NAM, NOH, BYEONG IL, KWON, OH TAK, LEE, SOOHEE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present specification provides: a photosensitive resin composition comprising a binder bearing an epoxy group, and an additive bearing a thiol group and a siloxane; a photosensitive material; a display device; and a method for low-temperature curing of a photosensitive resin composition.