TWI717823B

Throughput is improved in a substrate transfer device including a substrate transport robot having a substrate holding hand, and an aligner. A method of controlling a substrate transfer device includes moving a substrate holding hand holding a substrate to a predetermined ready position defined arou...

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Bibliographische Detailangaben
Hauptverfasser: BHARWANI, AVISH ASHOK, YOSHIDA, TETSUYA, ZENG, MING
Format: Patent
Sprache:chi
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Beschreibung
Zusammenfassung:Throughput is improved in a substrate transfer device including a substrate transport robot having a substrate holding hand, and an aligner. A method of controlling a substrate transfer device includes moving a substrate holding hand holding a substrate to a predetermined ready position defined around an aligner, moving the substrate holding hand to a predetermined placement position defined by the aligner to transfer the substrate to a turntable of the aligner, causing the aligner to align the substrate while causing the substrate holding hand to wait at a predetermined waiting position defined at a position closer to the placement position than the ready position is, moving the substrate holding hand to the placement position to transfer the substrate from the aligner to the substrate holding hand, and moving the substrate holding hand holding the substrate to the ready position.