TWI717451B

Provided are a reduced-pressure drying device and a reduced-pressure drying method whereby a coating film can be dried in a stable manner, even when a vacuum pump for reducing pressure of a chamber section has been increased in capacity. Specifically, a reduced-pressure drying device for drying a co...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ISHIWATARI, TORU, OKAMOTO, SHUNICHI
Format: Patent
Sprache:chi
Schlagworte:
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Beschreibung
Zusammenfassung:Provided are a reduced-pressure drying device and a reduced-pressure drying method whereby a coating film can be dried in a stable manner, even when a vacuum pump for reducing pressure of a chamber section has been increased in capacity. Specifically, a reduced-pressure drying device for drying a coating film coated on a substrate in a reduced-pressure environment, wherein are provided a chamber section having a substrate-accommodating part in which a substrate is accommodated, and a suction pressure-reducing section for reducing the pressure in the substrate-accommodating part by suctioning the substrate-accommodating part, the chamber section having a reduced-pressure adjusting part for limiting the pressure-reducing rate of the suction pressure-reducing section to adjust the substrate-accommodating part to a predetermined pressure by supplying a gas to the substrate-accommodating part.