Method for monitoring the total amount of sulphur containing compounds in a metal plating bath

The present invention relates to a method for monitoring the total amount of sulphur containing compounds in a metal or metal alloy plating bath, wherein the sulphur containing compounds contain at least one sulphur atom having an oxidation state below +6, the method comprising the steps (a), (b), o...

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Bibliographische Detailangaben
Hauptverfasser: STEINHAEUSER, EDITH, WENDELN, CHRISTIAN, GOTTSCHALK, KEVIN-SIGURT, NISHIKIDO, MAYUMI, ZARWELL, SEBASTIAN, KIRBS, ANDREAS
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The present invention relates to a method for monitoring the total amount of sulphur containing compounds in a metal or metal alloy plating bath, wherein the sulphur containing compounds contain at least one sulphur atom having an oxidation state below +6, the method comprising the steps (a), (b), optionally (c), and (d). Said method is a means of providing control over a metal plating process. Thus, the present invention relates furthermore to a controlled process for plating a metal on a substrate utilizing the method of the present invention for monitoring the total amount of said sulphur containing compounds.