TWI716424B

Provided is a resin composition capable of forming, in a short curing time, a cured object that is highly adhesive with respect to a PET substrate, that is colorless and transparent, and that has excellent heat resistance and moisture resistance. The resin composition contains: (A) a bifunctional al...

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Bibliographische Detailangaben
Hauptverfasser:	FUJII, ASUKA, OHTSU, TAKERU, YAMADA, TAKESHI, KASHIWAZAKI, FUMITO, MORI, TAKAHIRO
Format:	Patent
Sprache:	chi
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	Provided is a resin composition capable of forming, in a short curing time, a cured object that is highly adhesive with respect to a PET substrate, that is colorless and transparent, and that has excellent heat resistance and moisture resistance. The resin composition contains: (A) a bifunctional alicyclic epoxy resin compound; (B) a specific polybutadiene resin compound of which the polystyrene-equivalent number average molecular weight is 100-5000; and (C) a specific epoxy resin compound, wherein the contained proportion of component (A) is 10-60 mass%, the contained proportion of component (B) is 10-80 mass%, and the contained proportion of component (C) is 10-60 mass%.