SUBSTRTAE PROCESSING APPARATUS

This substrate processing device is provided with: an adhesion reinforcement unit (610) for supplying an adhesion-reinforcing agent composed of an organic material to one surface of a substrate (W); an irradiation unit (620) for irradiating the one surface of the substrate (W) to which the adhesion-reinforcing agent has been supplied by the adhesion reinforcement unit (610) with ultraviolet rays; and a film-forming unit for forming a processing film on the one surface of the substrate (W) by supplying a processing agent to the one surface of the substrate (W) that has been irradiated with the ultraviolet rays by the irradiation unit (620). This substrate processing method comprises: a step where an adhesion-reinforcing agent composed of an organic material is supplied to one surface of a substrate (W) by an adhesion reinforcement unit (610); a step where the one surface of the substrate (W) where the adhesion-reinforcing agent has been supplied by the adhesion reinforcement unit (610) is irradiated with ultra