TWI716130B
A plating device 1 is provided with a first plating tank 11A filled with a plating solution 3, an anode 14 disposed in the first plating tank 11A so as to face an article 2 to be plated, a cathode 12 for supplying power to the article 2 to be plated, and a shielding member 15 having a plate-shaped p...
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| Format: | Patent |
| Sprache: | chi |
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| Zusammenfassung: | A plating device 1 is provided with a first plating tank 11A filled with a plating solution 3, an anode 14 disposed in the first plating tank 11A so as to face an article 2 to be plated, a cathode 12 for supplying power to the article 2 to be plated, and a shielding member 15 having a plate-shaped part 151 interposed between the anode 14 and an end part of the article 2 to be plated, the anode 14 having a cover part 142 for covering an end part of the anode 14, and the plate-shaped part 151 having an opening 153a penetrating through the plate-shaped part 151. |
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