TWI714876B

This substrate processing device 1 performs substrate processing with a processing solution. The substrate processing device comprises: a chamber 10 capable of forming a sealed space wherein the substrate W is accommodated; a processing tank 11 disposed in the interior of the chamber, for storing th...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KAMIHIRO, YASUKATSU, KIMURA, MASAHIRO, YAMAGUCHI, YUJI
Format:	Patent
Sprache:	chi
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CLEANING CLEANING IN GENERAL DRYING DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEATING LIGHTING MECHANICAL ENGINEERING PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TRANSPORTING WEAPONS
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Beschreibung
Zusammenfassung:	This substrate processing device 1 performs substrate processing with a processing solution. The substrate processing device comprises: a chamber 10 capable of forming a sealed space wherein the substrate W is accommodated; a processing tank 11 disposed in the interior of the chamber, for storing the processing solution; a liquid elimination mechanism 17 for draining the processing solution from the interior of the chamber; a pressure-reducing mechanism 16 equipped with a vacuum pump 161, for reducing the pressure inside the chamber; and control means 19 controlling the pressure-reducing mechanism and the liquid elimination mechanism in such a manner that the pressure inside the chamber is reduced and the processing solution is drained under reduced pressure from the interior of the chamber.