TWI713684B

The present invention provides an adhesive composition, as an adhesive composition for use in a laminate for forming a plug by fan-out type technology, which has high chemical resistance and is capable of forming an adhesive layer capable of maintaining high viscoelasticity at a high temperature. Th...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TAMURA, KOKI, YOSHIOKA, TAKAHIRO, MASUJIMA, MASAHIRO, IMAI, HIROFUMI
Format:	Patent
Sprache:	chi
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES SEMICONDUCTOR DEVICES TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention provides an adhesive composition, as an adhesive composition for use in a laminate for forming a plug by fan-out type technology, which has high chemical resistance and is capable of forming an adhesive layer capable of maintaining high viscoelasticity at a high temperature. The adhesive composition, in the adhesive composition configured by interposing and laminating the adhesive layer on a support body for supporting the plug, comprises the plug comprising a wire layer on which an element is mounted, the element, and the plug for encapsulating the element, and comprises a block copolymer, a polymerizable monomer, and a polymerization initiator as an adhesive composition for forming the adhesive layer.