Processing tool and methods of operation same

Processing tool and methods of operation same

Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HSUEH, YA-HSUN, TSAI, MINGI, CHUANG, SHENG-HSIANG, PAI, JIUN-RONG, LIU, KUO-YI, LEE, CHIEN-FA, SURENDRA, KUMAR SONI, LIAO, CHIEN-KO, YU, CHENG-FEI, LIN, CHIA-HAN, TSAI, YUANN, KUO, SHOU-WEN, LIU, HSU-SHUI, LIAO, JIAO-ROU, WENG, WU-AN
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PHYSICS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.