Semiconductor device having passivation layer and method of making the same

A semiconductor device includes a conductive pad over an interconnect structure, wherein the conductive pad is electrically connected to an active device. The semiconductor device further includes a dielectric layer over the conductive pad, wherein the dielectric layer has a first conformity. The se...

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Bibliographische Detailangaben
Hauptverfasser: SHIH, YU LUNG, KUO, PO CHANG, LIN, YI AN, CHANG, CHING CHUAN, LI, CHAO KENG
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:A semiconductor device includes a conductive pad over an interconnect structure, wherein the conductive pad is electrically connected to an active device. The semiconductor device further includes a dielectric layer over the conductive pad, wherein the dielectric layer has a first conformity. The semiconductor device further includes a passivation layer over the dielectric layer, wherein the passivation layer has a second conformity different from the first conformity.