TWI708360B
A semiconductor device according to an embodiment includes a substrate, an α-ray shielding layer, a first semiconductor chip, and a second semiconductor chip. The α-ray shielding layer is provided on the substrate. The first semiconductor chip is provided on the α-ray shielding layer. The second sem...
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| Sprache: | chi |
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| Zusammenfassung: | A semiconductor device according to an embodiment includes a substrate, an α-ray shielding layer, a first semiconductor chip, and a second semiconductor chip. The α-ray shielding layer is provided on the substrate. The first semiconductor chip is provided on the α-ray shielding layer. The second semiconductor chip is provided on the first semiconductor chip, whose operation is controlled by the first semiconductor chip. |
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