Elektronisches funktionsbauteil und verfahren zur herstellung eines elektronischen funktionsbauteils

The invention relates to an electronic functional component and to a production method for an electronic functional component. The electronic functional component comprises an electronic component (20), which is embedded into the functional component by means of a three-dimensional printing process....

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SCHAAF, ULRICH, WAHL, RUBEN, BERSCHAUER, KRISTINA, KUGLER, ANDREAS
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TRANSPORTING
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Beschreibung
Zusammenfassung:	The invention relates to an electronic functional component and to a production method for an electronic functional component. The electronic functional component comprises an electronic component (20), which is embedded into the functional component by means of a three-dimensional printing process. By means of the three-dimensional printing process, individual adaptation with regard to the shape and mechanical properties of the functional component can be performed in addition to the enclosing of the electronic component. Furthermore, the electrical connections (21) of the electronic component are led to the surface (30a) of the functional component in a suitable form.