Wireless interconnects on flexible cables between computing platforms

Wireless interconnects are shown on flexible cables for communication between computing platforms. One example has an integrated circuit chip, a package substrate to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to extern...

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Bibliographische Detailangaben
Hauptverfasser: KAMGAING, TELESPHOR, DISCHLER, RICHARD J
Format: Patent
Sprache:chi ; eng
Schlagworte:
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