Wireless interconnects on flexible cables between computing platforms

Wireless interconnects are shown on flexible cables for communication between computing platforms. One example has an integrated circuit chip, a package substrate to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to extern...

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Hauptverfasser: KAMGAING, TELESPHOR, DISCHLER, RICHARD J
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:Wireless interconnects are shown on flexible cables for communication between computing platforms. One example has an integrated circuit chip, a package substrate to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components, a cable on the package substrate coupled to the integrated circuit chip at one end, a radio chip on the cable coupled to the cable at the other end, the radio chip to modulate data over a carrier and to transmit the modulated data, and a waveguide transition coupled to a dielectric waveguide to receive the transmitted modulated data from the radio and to couple it into the waveguide, the waveguide to carry the modulated data to an external component.