Chemical mechanical polishing pad composite polishing layer formulation

A chemical mechanical polishing pad is provided containing: a polishing layer having a polishing surface; wherein the polishing layer comprises a first continuous non-fugitive polymeric phase and a second non-fugitive polymeric phase; wherein the first continuous non-fugitive polymeric phase has a p...

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Bibliographische Detailangaben
Hauptverfasser: BRUGAROLAS BRUFAU, TERESA, LUGO, DIEGO, QIAN, BAINIAN, HENDRON, JEFFREY JAMES, TRAN, TONY QUAN, JACOB, GEORGE C, KOZHUKH, JULIA, MILLER, JEFFREY B, STACK, MARC R
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:A chemical mechanical polishing pad is provided containing: a polishing layer having a polishing surface; wherein the polishing layer comprises a first continuous non-fugitive polymeric phase and a second non-fugitive polymeric phase; wherein the first continuous non-fugitive polymeric phase has a plurality of periodic recesses; wherein the plurality of periodic recesses are occupied with the second non-fugitive polymeric phase; wherein the first continuous non-fugitive polymeric phase has an open cell porosity of ≦6 vol %; wherein the second non-fugitive polymeric phase contains an open cell porosity of ≧10 vol %; and, wherein the polishing surface is adapted for polishing a substrate.